Beginning at the top of the board we see the FM1 socket. This is the home of the Llano Lynx APU. The 32nm design of the Llano chip has meant that the combined CPU and GPU barely take up any more room than the previous generation of 45nm 'CPU only' designs. As a result of that the basic chip size (including heatspreader) is similar enough to be able to use original AM3 socket compatible designs with the FM1 socket.
For users with valuable aftermarket coolers this will come as good news since they won't need to buy replacement retention kits... or in the worst case a whole new heatsink.
FM1 socket.
To the left of the socket is the mosfet heatsink. A passive design it should work well to deal with the heat put out by the power section of the board. The E3850's TDP of 100w is very similar to the average Athlon/Phenom quad core so I have no concerns regarding its ability to cope.
Mosfet sink.
On the right of the socket are the four DDR3 DIMM slots. These are rated to cope with 1866MHz DIMMS when only two slots are populated and 1600MHz with all four populated.
DIMM slots.
Next to the DIMMS we have a parallel port connector (LPT), the 24-pin ATX power connector, trusted platform modular header (TPM) and system fan header.
24-pin ATX and extras.
Moving towards the base of the board we can see the BIOS battery and the blue USB 3.0 socket which can be used in conjunction with an optional 3.5" front panel. There's a COM port and front panel connector assembly for activity lights, power/reset functionality, etc. Also in view are the five SATA 6.0Gbps sockets and the boards passive chipset heatsink.
Chipset sink and SATA sockets dominate.
