New AMD Embedded G-Series APUs Provide Thirty Nine Percent Power Reduction for Fanless Designs

News Editor: Tony Le Bourne Date: 24-05-2011 [ Print | 2 comment(s) ]  Discuss in Forums

AMD Fusion technology, named “Best in Show” at Embedded Systems Conference, is available for full-featured, fanless embedded systems in as little as 5.5W

PRESS RELEASE

SUNNYVALE, Calif. —5/23/2011

AMD (NYSE: AMD) today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions1. The very low power consumption and small 361mm² package is ideal for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. This is an unprecedented low-power offering for the embedded market that features one or two low-power x86 “Bobcat” CPU cores and a discreet class DirectX® 11-capable GPU on a single die.

“We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement,” said Buddy Broeker, director, Embedded Solutions, AMD. “System designers can now unleash their creativity without being constrained by heat or size issues.”

A fanless solution is crucial for many small embedded systems where the added cost for an active cooling system can be prohibitive or for environments where silent operation is a key requirement. Additionally, many embedded products are deployed in harsh environmental conditions where the presence of a fan represents a potential failure point for the system. The AMD Embedded G-Series platform provides enterprise-class features and performance with the reliability, cost- and power-efficiencies these systems require.

Systems based on the new low power AMD Embedded G-Series platform include an industrial mobile device from Amtek, a Pico-ITX single board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE. Additional customers are expected to bring new products to market in the coming quarters.
Additional Resources:

AMD@Work/Embedded blog
Guest blog post from Amtek
Guest blog post from Axiomtek
Guest blog post from datakamp
www.amd.com/embedded
AMD Embedded Developer Support
Registration for the AMD Fusion Developer Summit



AMD's APU design


About AMD

AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its groundbreaking AMD Fusion Accelerated Processing Units (APUs) that power a wide range of computing devices. AMD’s server computing products are focused on driving industry-leading cloud computing and virtualization environments. AMD’s superior graphics technologies are found in a variety of solutions ranging from game consoles, PCs to supercomputers. For more information, visit http://www.amd.com.


Tagged as: AMD, APU, fusion, bobcat, G series, SoC

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New AMD Embedded G-Series APUs Provide Thirty Nine Percent Power Reduction for Fanless Designs

gt_junkie



Posts: 563
Joined: 2009-02-12

#15622 Posted on: 24.05.2011 07:12:19
Thats power draw is very impressive indeed!

Like they say, they'd be perfect for fanless application.

gt

New AMD Embedded G-Series APUs Provide Thirty Nine Percent Power Reduction for Fanless Designs

I3R0K3N7FEET



Posts: 700
Joined: 2011-02-26

#15635 Posted on: 24.05.2011 15:21:48
these are just revisions of current bobcat and for the thermal performance may as well stick with the dual core version imo but it seems each watt counts here.

cant wait to see how the 28nm versions do.

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