Moving closer you can see the dual heat pipe design at work. The diameter of the pipes tends to correlate with performance so by the look of these they should do a decent job!
The heatsinks large heatpipe assembly.
There actually looks to be a third heatpipe in place but since ASUS only list it as having two I presume that it loops back via the end cap sat at the I/O end of the heatsink.
The heatsink cap sat over the I/O plate.
From a low angle you can just about see the heatsinks large base plate.
Heatsink base plate.
Removing the board reveals the two main board chips - the Hudson M1 on the left and the Zacate E350 on the right.
The two board chips.
The heatsink uses two copper plates to contact the dual heatpipes. There are also soft chip standoffs to help protect the naked cores from angled contacts with the plates. ASUS have used solid setting TIM pads - the only negative of this approach is that if the heatsink is removed it's a bit of a job to remove the hardened material and reapply. You certainly shouldn't ever simply pop it back 'as is' since the contact will never be the same.
The heatsink plates and TIM.
Close ups of the chips at work on the board...
The Zacate E350 dual core APU. The brains of the board.
The E350.
And the Hudson M1 which takes care of the six SATA 6.0Gbps ports!
Hudson M1.
