ASUS GTX 770 DirectCU II OC Review

👤by Richard Weatherstone Comments 📅23-08-13
Features

DirectCU II with SSU architecture

20% cooler, 3X quieter

ASUS graphics card engineering leads the industry once again with the introduction of DirectCU II SSU thermal design. Comprising two “S” and one “U” shapes, the new heatpipes are precision shaped for optimal efficiency and heat transference. They are also nickel-plated to minimize oxidization, with their mid-section now placed directly over the GPU die. This design shortens heat transfer travel to lower thermal resistance and create bi-directional flow for up to twice the cooling capacity in the same space as that required by existing graphics card cooler designs. High-conductivity copper used in heatpipe formulation creates tube-like vapor chambers, moving heat to a large aluminum heatsink that features extended fins for multiple points of dissipation. The assembly is further chilled by two high performance but carefully-tuned and sound-dampened fans for faster and quieter cooling.

DIGI+ VRM with Super Alloy Power

30% less power noise and 2.5X greater durability

Acclaimed DIGI+ VRM has been applied via a 10-phase power design that uses digital voltage regulators to minimize power noise by 30%, enhance power efficiency by 15%, widen voltage modulation tolerance, and improve overall stability and longevity by 2.5 times over reference.

GPU Tweak

Real-time intuitive graphics tuning

Shows detailed specs and actual card status with GPU-Z
Monitoring widget provides real-time detailed multi-parameter info
Automatically checks and updates drivers and BIOS versions.


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