H55 is an all-in-one liquid cooler and has a radiator with the dimensions 120mm x 152mm x 27mm and is made entirely of aluminium. Being 120mm and only 27mm thick this radiator is ideal to mount in the area which usually occupies the rear exhaust fan in a computer chassis.
Tubing directly links the radiator to its pump and is made of rubber which is 10mm thick.
An overview of H55
The pump is responsible for the transfer of liquid and is low-profile to encourage good compatibility for memory and other hardware. In order to get power/functionality to the pump a 3-pin connector is required to plug into a fan header on the motherboard.
The baseplate surface is of copper construction and has a thin layer of pre-applied thermal compound paste (Dow-corning) so that H55 is ready to install and go. The baseplate is large enough to entertain numerous socket sizes/types. The blocks which surround the edge of the pump allow the unit to securely fix to the installation retention ring. Those who arent aware, unlike the H60, H80i and H100i which is based around CoolIT the H55 is actually based on an Asetek platform.
Low-profile pump with adjustable tubing mounts
Copper baseplate with pre-applied thermal compound paste