If you’ve seen any GIGABYTE AORUS motherboard from the past 18 months or so, the styling will be familiar. The black and silver theme looks great, if you ask us, lending itself well to the addition of RGB components which is all the rage right now. The AORUS PRO houses a couple of small RGB strips, one within the large block covering the rear IO and another behind the bottom-left section of the motherboard where the integrated soundcard resides.
The board conforms to the usual ATX standard, 305mm x 244mm so will fit into most cases.
Lined up around the AM4 CPU socket is a 12+2 phase IR digital power design supplied by an 8+4 power connection in the top-left. Keeping the VRMs cool is a two-part heatsink, with an extensive fin array for massively increased surface area (around 300% more than a typical heatsink of equal size), joined up by a direct-touch heatpipe for optimal thermal transfer.
The four DRAM slots feature GIGABYTE’s Ultra Durable Memory Armour that prevents against PCB distortion, twisting or bending and reduces the chance of any possibly ESD interference for better memory stability.
DDR4 memory support extends all the way up to 4400MHz via XMP profiles. GIGABYTE work closely with memory vendors and go through rigorous testing procedures to ensure their motherboards with over 1000 different memory kits for the best possible compatibility.
Also located in this region are a pair of CPU 4-pin PWM fan connections and a pair of RGB headers. The small white button is GIGABYTE’s Q Flash Plus, allowing you to upgrade the BIOS on the motherboard without a CPU, GPU or RAM installed, handy for a variety of reasons. Finally, there’s the 24-pin motherboard power connection, a trio of PWM 4-pin fan headers and a USB 3.2 Gen 1 front header.
The bottom half of the X570 AORUS PRO is kitted out with several PCI-E devices, all operating on the new 4.0 specification brought about by AMD’s 3000-series processors.
There’s a couple of NVMe slots, both of which are adorned with Thermal Guard heatsinks which, in theory, help to reduce the temperature of power-hungry NVMe drives to preserve peak performance for longer. These may be particularly useful for the current crop of PCI-E 4.0 NVMe drives with a considerable increase in bandwidth over their 3.0 counterparts.
Alongside the M.2 ports are three PCI-E x16 slots, two of which feature GIGABYTE’s Ultra Dural PCI-E Armour for a much stronger port. This is arguably much more important than the armour wrapped around the DRAM slots with the weight of some GPUs and their triple slot coolers posing a real threat to some weaker all-plastic slot designs. Finally there’s a couple of PCI-E x1 ports for smaller add-in cards.
Rounding out the AORUS PRO’s storage options, in the bottom-right of the board are six 90° SATA 3.0 headers.
The board conforms to the usual ATX standard, 305mm x 244mm so will fit into most cases.
Lined up around the AM4 CPU socket is a 12+2 phase IR digital power design supplied by an 8+4 power connection in the top-left. Keeping the VRMs cool is a two-part heatsink, with an extensive fin array for massively increased surface area (around 300% more than a typical heatsink of equal size), joined up by a direct-touch heatpipe for optimal thermal transfer.
The four DRAM slots feature GIGABYTE’s Ultra Durable Memory Armour that prevents against PCB distortion, twisting or bending and reduces the chance of any possibly ESD interference for better memory stability.
DDR4 memory support extends all the way up to 4400MHz via XMP profiles. GIGABYTE work closely with memory vendors and go through rigorous testing procedures to ensure their motherboards with over 1000 different memory kits for the best possible compatibility.
Also located in this region are a pair of CPU 4-pin PWM fan connections and a pair of RGB headers. The small white button is GIGABYTE’s Q Flash Plus, allowing you to upgrade the BIOS on the motherboard without a CPU, GPU or RAM installed, handy for a variety of reasons. Finally, there’s the 24-pin motherboard power connection, a trio of PWM 4-pin fan headers and a USB 3.2 Gen 1 front header.
The bottom half of the X570 AORUS PRO is kitted out with several PCI-E devices, all operating on the new 4.0 specification brought about by AMD’s 3000-series processors.
There’s a couple of NVMe slots, both of which are adorned with Thermal Guard heatsinks which, in theory, help to reduce the temperature of power-hungry NVMe drives to preserve peak performance for longer. These may be particularly useful for the current crop of PCI-E 4.0 NVMe drives with a considerable increase in bandwidth over their 3.0 counterparts.
Alongside the M.2 ports are three PCI-E x16 slots, two of which feature GIGABYTE’s Ultra Dural PCI-E Armour for a much stronger port. This is arguably much more important than the armour wrapped around the DRAM slots with the weight of some GPUs and their triple slot coolers posing a real threat to some weaker all-plastic slot designs. Finally there’s a couple of PCI-E x1 ports for smaller add-in cards.
Rounding out the AORUS PRO’s storage options, in the bottom-right of the board are six 90° SATA 3.0 headers.
