The Samsung Green DDR3 kit arrives with us in a cardboard blister pack. The front of the packaging leaves you in no doubt about the specifications of this kit, detailing the capacity, speed and that we are dealing with 30nm low voltage modules.

The back of the packaging goes further to tell us the voltage and other specifications to expect. Being a blister pack, to get inside we unfortunately have to destroy the packaging. Personally I’m not a fan of this method of packaging.





Removing the modules from their packaging an initial observation reveals this kit is significantly shorter than a traditional DDR3 kit – even those without heatsinks.

Printed on one side of each module are the specifications labels, stating the serial number and other details about the kit such as CAS timings which are 11-11-11-28. This kit is low voltage at just 1.35v and doesn’t have to acquire components from other vendors since Samsung are a supplier. Throughout Samsung have used 30nm HYK0 components and of course a much shorter PCB.


For size comparison the Green DD3 kit has been placed along-side a popular low-profile DDR3 kit – Kingston Genesis HyperX. Whilst the Samsung kit still fits inside the DDR3 specifications (240pin) the Samsung kit is clearly of different stature.

Overall height of the Kingston DDR3 module is 2.8cm – the heatspreader increases the height by a mere 1mm meaning the kit provides excellent clearance for those with big CPU coolers. The Samsung kit goes further than this to deliver even more clearance, side by side the Samsung module is almost half the size of the Kingston at just under 2cm in total height. This is fantastic news for those wanting minimal obstruction.





On the next page we will be putting this kit through its paces to determine what we can expect in terms of performance.