ASRock introduces the new X299 OC Formula motherboard oriented for overclocking and designed by ASRock’s resident professional overclocker Nick Shih. It features a solid CPU VRM design with 13-phase CPU power design along with a 2-phase memory power design for improved overclocking headroom with lower temperatures. The X299 OC Formula packs XXL Aluminum Alloy Heatsink/Heatpipe to effectively dissipate heat from the MOSFETs especially on overclocked settings which allows the motherboard to support up to 450W CPU.

To further enhance overclocking capabilities of the ASRock X299 OC Formula, the motherboard uses a specially designed 8-layer PCB and supports quad-channel memory supporting up to 4800MHz with just air cooling as achieved by Nick Shih himself. The X299 OC Formula also supports the upcoming fastest XMP profiles of DDR4-4500MHz with the Intel Core-X processors from DRAM makers like Corsair, G.SKILL, Team Group and others.

X299 OC Formula Features
- Supports Intel Core X-Series Processor Family for the LGA 2066 Socket
- 13 Phase CPU Power Design + 2 Phase Memory Power Design, Dr. MOS
- Supports Quad Channel DDR4 4600+(OC) Memory
- 5 PCIe 3.0 x16, 1 PCIe 3.0 x4, 1 PCIe 2.0 x1
- Supports NVIDIA 4-Way SLI and AMD 4-Way CrossFireX
- 7.1 CH HD Audio (Realtek ALC1220 Audio Codec), Supports Purity Sound 4 & DTS Connect
- 8 SATA3, 2 Ultra M.2 (PCIe Gen3 x4 & SATA3)
- 3 USB 3.1 Gen2 (1 Front Type-C, 1 Rear Type-C, 1 Rear Type-A)
- 6 USB 3.1 Gen1 (2 Front, 4 Rear)
- Dual Intel Gigabit LAN
- ASRock RGB LED
- Hyper BCLK Engine III
- OC Formula Kit, Nick Shih’s OC Profile



For more information, visit the product page at http://www.asrock.com/mb/Intel/X299%20OC%20Formula/index.asp