SK Hynix Mass Produces 72-Layer 512Gb 3D NAND Flash For eSSDs
SK Hynix has successfully developed new enterprise-class SATA SSD and PCIe SSD using its 72-Layer 512Gb (Gigabits) 3D NAND flash chips and will now be mass produced. The new Hynix eSSDs promises to offer a high value-added enterprise-class SSD in the market brought by the increased maximum density. It will be offered in both 2.5-inch SATA and M.2 2280 PCIe form factors.
The upcoming SATA eSSD will sport the 72-layer 512Gb 3D NAND Flash along with an in-house developed firmware and controller enabling a maximum density of up to 4TB, twice the capacity of SSDs with 256GB NAND chips, offering more high-speed storage space for media and applications. The new Hynix SATA eSSD would offer impressive speeds of up to 560MB/s sequential read and 515MB/s sequential write. It promises to perform up to 98000 random read IOPS and 32000 random writer IOPS.
This upcoming enterprise-class PCIe SSD built with the new Hynix 72-layer 512Gb 3D NAND Flash will feature capacities of up to 1TB with speeds of up to 2700MB/s sequential read and 1100MB/s sequential write, random read IOPS of 230,000 and random write IOPS of 35,000.
SK Hynix began its mass production of Client SSDs with 3D NAND chips with in-house firmware and controller last year. The addition of the Business eSSDs not only expands the brand’s portfolio but also to tackle the growing needs of the SSD market.
Source: SK Hynix Press