GIGABYTE GTX 780 OC Windforce x3 (Rev 2.0) Review

👤by Richard Weatherstone Comments 📅10-08-13
Closer Look


The 450W cooling capacity heatsink design is, as suspected, split into two heatsink arrays which are joined 'at the hip' by 5 copper heatpipes. Each heatpipe is soldered to a large copper baseplate and framed by an aluminium memory heatsink sink.


The soldering on the heatpipes was a little messy in truth but as you can't actually see this area it isn't a major concern as there was no signs of cracking which meant a good solid fit to the fins, in turn meaning heat transfer would be very good.


The copper baseplate was not a shiny polished affair; rather it had a dull sheen thanks to the rough, slightly buffed surface. GPU core contact was however excellent so there is no reason to remove the heatsink yourself unless you have a preference for your own GPU/CPU TIM.


The VRM area features an 8+2 phase design and incorporates solid state capacitors and ferrite core chokes. the 8-phase design, as opposed to the 6 phases found on the revision 1 design, will deliver more stable power while keeping the MOSFETs cooler thereby extending the life of the GPU.


The memory hails from Samsung and carries the product code of K4G203255FD FC03. We know this is some seriously fast memory if past tests are anything to go by.


The core of the GTX780 is essentially the same GK110 used in the TITAN with a couple of SMX's disabled.


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