GIGABYTE GTX 750 Ti OC Review

👤by Richard Weatherstone Comments 📅26-04-14
Closer Look

The heatsink is made up of the Windforce Twin PWM fans that are parallel inclined to match the parallel inclined aluminium finned heatsink below. There is a further aluminium block through which twists a single, flattened 8mm copper pipe. This heatpipe assistS with heat dissipation across both sections of the finned heatsink array.


With the heatsink removed we find a similar PCB to reference with a 2+1 phase design and 4x512MB memory chips framing the main processing unit. The GIGABYTE card however features beefed up chokes and an extra capacitor to assist with the extra power delivery available to this component.


Speaking over power, above is the main VRM of the card along with a shot of the 6pin power socket. This allows the card to draw on double the available power of the reference design (150W vs. 75W). The reference design can only draw its power from the PCIe socket where the GIGABYTE design has both PCIe and direct PSU power available.


The memory available on the card comes in the form of 4x512MB GDDR5 chips courtesy of SKHyinx carrying the product code of H5GC4H24MFR T2C so should be good for some high memory overclocks.


At the heart of the card we find the first example of NVIDIA's Maxwell core. This sliver of silicon promises much for the future of NVIDIA and while this is only a low-end example, a full blown Maxwell core is expected to be the cream of the crop come release time.

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