Capacities
-400GB, 1.2TB

PCIe* Gen3 x4

Form Factor
-2.5-inch Form Factor
-15mm Z-height
-8639-compatible connector
-Add-in Card (AIC) Form Factor
-Half-height, Half-length
-Single slot x4 connector

Performance
-Seq R/W: Up to 2400/1200 MB/s3
-4K Random Read: Up to 440K
-4K Random Write: Up to 290K

Latency (average sequential)
-Read: 20 µs (TYP)
-Write: 20 µs (TYP)

Components
-Intel® 20nm MLC NAND Flash Memory

Operating System Support:
-Windows 7* 64 bit
-Windows 8* 64 bit
-Windows 8.1* 64 bit
-UEFI* 2.3.1 or later

Reliability
-Uncorrectable Bit Error Rate (UBER):
1 sector per 1016 bits read
-Mean Time Before Failure (MTBF):
1.2 million hours

Power
-2.5-inch: 3.3V and 12V Supply Rail
-AIC: 3.3V and 12V Supply Rail
-Enhanced power-loss data protection
-Active/Idle (TYP): 25W/4W (TYP)

Compliance
-NVM Express* 1.0
-PCI Express* Base Specification Rev 3.0
-SFF 8639 Enterprise SSD Form Factor
Version 1.0a
-PCI Express Card Electro-Mechanical*
(CEM) Specification Rev 2.0

Certifications and Declarations
-UL*, CE*, C-Tick*, BSMI*, KCC*,
Microsoft WHQL*, VCCI*

Endurance Rating
-70 GB Writes Per Day
-Up to 219 TBW (Terabytes Written)5

Temperature Specification
-Operating:
-AIC: 0 to 55° C
-2.5-inch: 0 to 70° C
-Non-Operating
: -55 to 95° C
-Temperature monitoring

Weight
-AIC: up to 195 gm
-2.5-inch: up to 125 gm

Shock
-2.5-inch: 1,000 G/0.5msec
-AIC: 50 G Trapezoidal, 170 in/s

Vibration
-Operating: 2.17 GRMS (5-700Hz)
-Non-Operating: 3.13 GRMS (5-800Hz)

Altitude (Simulated)
-Operating: -1,000 to 10,000 ft
-Non-Operating: -1,000 to 40,000 ft

Product Ecological Compliance
-RoHS