LEPA LPC302 Series Review

👤by David Mitchelson Comments 📅26-08-11
Conclusion

Although the LEPA LPC302 does follow current trends quite closely it still distinguishes itself as an individual chassis. The eagle-eyed amongst you may well notice some key similarities in its appearance to the Cooler Master CM690-II but this isn’t a bad thing – afterall this case is extremely popular.

It brings a touch of class to the gaming world with its smooth looks and subtle styling. Being a new brand, many gamers/enthusiasts will not have heard about LEPA and taking this to a LAN party is certainly going to attract plenty of attention, good attention that is.

Inside LPC302 there is room to accommodate high-end components and with tool-less design mechanisms featured throughout, getting kit inside is only ever going to be easy. The only thing that needed screwing down during our analysis of this case was the motherboard.



Elements that I think could see some improvement are the cables that route through from the front panel. They look cheap and come in abundance, hiding them can be difficult – I would like to see LEPA use black cabling inside this chassis, especially as the interior is entirely black. It would make hiding those cables much easier. USB3.0 is now being integrated into almost every case on the market but it’s a shame to see that we are still having to use a USB cable fed through to the motherboard I/O panel. LEPA should be using a USB3.0 header cable. All motherboards that are post fall 2010 incorporate USB3.0 headers.

The bottom line is: LEPA have done a great job with the LPC302 series. It looks appealing and accommodates high-end equipment. At the moment we can’t comment on the price-tag but we would hope it would reflect the brand image of being affordable.

Pros
+ Stylish looks
+ Will accomodate high-end components
+ Tool-less throughout
+ Good thermal performance

Cons
- All cabling should be black
- Still standard USB3.0 cable and not header




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